l 8 1 0 h w - 1 r 0 m f - (a) (c) (b) (e) (d) 1. part no. expression : (b) type code (c) inductance code : 1r0 = 1.0uh (a) series code 2. configuration & dimensions : 13.5 max. a' a b' 4. materials : superworld electronics (s) pte ltd (a) core (b) wire (c) terminal a 3. schematic : (d) tolerance code : m = 20% (e) f : rohs compliant 5. features : b) frequency up to 5mhz a) shielded construction l810hw series high current molded power inductors b c pg. 1 note : specifications subject to change without notice. please check our website for latest information. 25.08.2010 pcb pattern h g 12.70.3 bc' c 3.7 max. 3.5 max. b' d e c' c b a' sworld r47 a 2.50.5 d 3.00.5 7.0 ref. 4.5 ref. 15.0 ref. eghl unit:m/m l 12.70.3 13.9 max. (f) (f) 11 ~ 99 : internal controlled number
superworld electronics (s) pte ltd 7. electrical characteristics : l810hw series note : specifications subject to change without notice. please check our website for latest information. pg. 2 25.08.2010 h) part temperature (ambient+temp. rise) : should not exceed 125c under worst case operating conditions. g) saturation current (isat) : will c ause l to drop approximately 20% typ. a) test freq. : q : 100khz/1.0v f) heat rated current (irms) : will cause the coil temp. rise approximately ? t=40c without core loss. b) ambient temp. : 20c e) humidity range : 50 ~ 60% rh c) operating temp. : -55c to +125c d) storage temp. : -55c to +125c 0 6. general specification : 16 2.20 l810hw-2r2mf- l810hw-100mf- l810hw-4r7mf- l810hw-3r3mf- l810hw-6r8mf- 4.70 10.0 6.80 3.30 10 7 9 12 inductance l l810hw-1r0mf- l810hw-1r5mf- l810hw-r47mf- l810hw-r68mf- part no. typ. 20% @ 0 adc 0.68 1.50 1.00 0.47 28 19 24 32 ( h ) 0 ( a ) irms 20 8.0 20 16 9.5 13 18 15 34 22 12 20 20 20 20 dcr max. ( m
) 2.0 2.5 5.5 3.5 typ. 40 28 36 44 ( a ) isat min. 12 20 20 12 q high current molded power inductors test ( hz ) 1.0v/100k frequency 1.0v/100k 1.0v/100k 1.0v/100k 1.0v/100k 1.0v/100k 1.0v/100k 1.0v/100k 1.0v/100k l810hw-r82mf- 0.82 0.25v/100k 25 38 3.0 -
superworld electronics (s) pte ltd l810hw series note : specifications subject to change without notice. please check our website for latest information. pg. 3 25.08.2010 inductance vs. frequency q vs. frequency inductance vs. dc current 8. characteristics curves : temp. rise vs. dc current high current molded power inductors
superworld electronics (s) pte ltd l810hw series note : specifications subject to change without notice. please check our website for latest information. pg. 4 25.08.2010 8. characteristics curves : high current molded power inductors 0 8. 8 17. 6 2 6.4 35 . 2 44 dc current(a) 0 0.2 0.4 0.6 0.8 inductance (uh) 0 10 20 30 40 50 60 70 80 90 100 temp. rise( o c) smpi120 3hw-r4 7 l810hw -r47mf l810hw-r47mf- ? ? 0 8.8 17.6 26.4 35.2 4 4 dc curr ent(a) 0 0.3 0.6 0.9 1.2 1.5 inductance (uh) 0 10 20 30 40 50 60 70 80 90 100 temp. rise( o c) sm pi1203h w-r6 8 l810hw -r68mf l810hw-r68mf- ? ? l810hw-r82mf l810hw-r82mf- ? ? 0 8 16 24 32 40 dc current(a) 0 0.3 0.6 0.9 1.2 1.5 inductance (uh) 0 10 20 30 40 50 60 70 80 90 100 temp. rise( o c) s mpi12 03hw-1r0 l810hw -1r0m f l810hw -1r0mf- ? ? 0 5.6 11.216.822.4 28 dc current(a) 0 0.6 1.2 1.8 2.4 3 i nduct ance (uh) 0 10 20 30 40 50 60 70 80 90 100 t em p. rise( o c) smpi1203hw-1r5 l810hw-1r5mf l810hw-1r5mf- ? ? 0 4 8 12162024 dc current(a) 0 0.8 1.6 2.4 3.2 4 inductance (uh) 0 10 20 30 40 50 60 70 80 90 100 temp. rise( o c) smpi1203hw-2r2 l810hw -2r2mf l810hw -2r2mf- ? ?
superworld electronics (s) pte ltd note : specifications subject to change without notice. please check our website for latest information. pg. 5 25.08.2010 l810hw series 8. characteristics curves : high current molded power inductors 048121620 dc current(a) 0 1.2 2.4 3.6 4.8 6 i nduct ance (uh) 0 10 20 30 40 50 60 70 80 90 100 temp. rise( o c) smpi1203hw-3r3 l810hw -3r3mf l810hw-3r3mf- ? ? 048121620 dc current(a) 0 1.6 3.2 4.8 6.4 8 i nduct ance (uh ) 0 10 20 30 40 50 60 70 80 90 100 temp. rise( o c) smpi120 3hw-4r7 l810hw-4r7mf l810hw-4r7mf- ? ? 0 2.6 5.2 7.8 10.4 13 dc current (a) 0 2 4 6 8 10 i nduct ance (uh ) 0 10 20 30 40 50 60 70 80 90 100 temp. rise( o c) smpi1203hw-6r8 l810hw-6r8mf l810hw-6r8mf- ? ? 02.24.46.68.811 dc curren t(a) 0 3 6 9 12 15 induct ance (uh) 0 10 20 30 40 50 60 70 80 90 100 tem p. rise( o c) smpi1203hw-100 l810hw-100mf l810hw-100mf- ? ?
note : specifications subject to change without notice. please check our website for latest information. superworld electronics (s) pte ltd pg. 6 25.08.2010 l810hw series 9. core loss : 500khz 100khz 100khz a nd 500khz 0 200 400 600 800 1000 gauss 0 10000 20000 30000 40000 k w /m 3 100khz 500khz kw / m 3 gauss material gauss loss 100 - 266 200 - 1,234 300 351.7 2,932 400 665.9 5,195 500 1,039 8,336 600 1,471 12,025 700 1,923 15,715 800 2,537 20,444 900 3,148 25,429 1000 3,902 31,002 100khz 500khz 200 400 600 800 1000 gauss 0 1000 2000 3000 4000 k w /m 3 kw / m 3 gauss material gauss loss 300 351.7 400 665.9 500 1,039 600 1,471 700 1,923 800 2,537 900 3,148 1000 3,902 100khz 0 200 400 600 800 1000 gauss 0 10000 20000 30000 40000 k w /m 3 kw / m 3 gauss high current molded power inductors
superworld electronics (s) pte ltd note : specifications subject to change without notice. please check our website for latest information. pg. 7 25.08.2010 l810hw series 10. reliability and test condition : electrical characteristics test defects harmful to the characteristics should not be allowed. appearance : cracking, shipping and any other 1. appearance : no damage 2. inductance : within 20% of initial value. no disconnection or short circuit. random vibration test humidity resistance 1. appearance : no damage 2. inductance : within 20% of initial value. no disconnection or short circuit. thermal shock low temperature high temperature life test life test total : 5 cycles directions & times : x, y, z directions for 2 hours. a period of 2 hours in each of 3 mutually perpendicular measure at room temperature after placing for 2 to 3 hrs. measure at room temperature after placing for 2 to 3 hrs. amplitude : 1.52mm frequency : 10-55-10hz for 1 min. directions (total 6 hours). humidity : 90% to 95% applied current : rated current time : 50012 hours temperature : 405c times (min.) 303 within 3 within 3 303 measure at room temperature after placing for 2 to 3 hrs. measure at room temperature after placing for 2 to 3 hrs. temperature (c) room temperature room temperature conditions of 1 cycle. 2 3 4 step 1 +1253 -553 time : 50012 hours time : 50012 hours temperature : -555c temperature : 1255c natural preheating dipping 2. inductance change : within 20% 1. appearance : no significant abnormality reliability test solder heat resistance preheating 60 seconds 150c 260c 100.5 seconds dipping natural cooling 60 seconds 150c 245c 41 seconds cooling refer to standard electrical characteristics list more than 90% of the terminal electrode should be covered with solder. solderability test mechanical performance test saturation current (isat) heat rated current (irms) dcr inductance flux for lead free : rosin solder temper ature : 2605c flux for lead free : rosin dip time : 100.5sec. solder : sn99.95-cu0.05 preheat : 150c, 60sec. dip time : 41sec. irms(a) will cause the coil temperature rise approximately ? t=40c without core loss hp4284a, ch11025, ch 3302, ch 1320, ch1320s ch16502, agilent33420a micro-ohm meter. isat(a) will cause lo to drop approximately 20% 2. temperature measured by digital surface thermometer solder temper ature : 2455c preheat : 150c, 60sec. solder : sn99.95-cu0.05 1. applied the allowed dc current lcr meter. item performance test condition high current molded power inductors
note : specifications subject to change without notice. please check our website for latest information. superworld electronics (s) pte ltd pg. 8 25.08.2010 l810hw series 11. soldering and mounting : c) never contact the ceramic with the iron tip e) use a 20 watt soldering iron with tip diameter of 1.0mm 30~60s temperature c 60~120s figure 1. re-flow soldering preheating 230 150 180 250~260 soldering 10s max. natural cooling d) 1.0mm tip diameter (max) f) limit soldering time to 3 secs. temperature c gradual cooling within 3secs. figure 2. iron soldering over 1min. soldering preheating 260 150 280 cooling natural 11-2.2 soldering iron (figure 2) : a soldering iron must be employed the following precautions are recommended. products attachment with soldering iron is discouraged due to the inherent process control limitations. in the event that recommended temperature profiles for re-flow soldering in figure 1. mildly activated rosin fluxes are preferred. the minimu m amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder , chip and substrate. our terminations are suitable for all wave and re-flow soldering systems. if hand soldering cannot be avoided, the preferred technique is the utilization of hot a) preheat circuit and products to 150c. air soldering tools. 11-2.1 solder re-flow : note : b) 280c tip temperature (max) 4.0 11-2. soldering 4.0 4.5 7.0 11-1. recommended pc board pattern high current molded power inductors
superworld electronics (s) pte ltd note : specifications subject to change without notice. please check our website for latest information. pg. 9 25.08.2010 l810hw series 12. packaging information : bo ko t 4.00.1 ?1.5+0.1 2.00.1 1.750.1 bo(mm) 13.90.1 12-3. packaging quantity 0.15 min l810hw series ao(mm) 13.50.1 11.50.1 f(mm) ao p(mm) 16.00.1 ko(mm) 4.50.1 w(mm) 24.00.3 p 0.350.05 t(mm) f w 12-2 tape dimension 24.00.5 a(mm) 13" x 24mm type 1002.0 b(mm) d d(mm) 13.50.5 330 c(mm) embossed carrier b a cover tape 12-1. reel dimension l810hw 4800 1200 carton chip / reel inner box size 600 2.00.5 ?c high current molded power inductors
superworld electronics (s) pte ltd note : specifications subject to change without notice. please check our website for latest information. pg. 10 25.08.2010 l810hw series 12-4. tearing off force the force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. a) products should be handled with care to avoid damage or contamination from perspiration and skin oils. 1. storage conditions : to maintain the solderabililty of terminal electrodes : a) temperature and humidity conditions : less than 30c and 70% rh. b) recommended products should be used within 6 months from the time of delivery. c) the packaging material should be kept where no chlorine or sulfur exists in the air. b) the use of tweezers or vacuum pick up is strongly recommended for individual components. c) bulk handling should ensure that abrasion and mechanical shock are minimized. 2. transportation : application notice top cover tape f base tape 1 6 5 t o 1 8 0 room temp. (c) 5~35 room humidity (%) 45~85 tearing speed (mm/min) 300 room atm (hpa) 860~1060 high current molded power inductors
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